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Chip-scale package (CSP) is a category of integrated circuit package which is surface mountable and whose area is not more than 1.2 times the original die area. This definition of chip-scale package is based on the IPC/JEDEC J-STD-012. Since the introduction of chip-scale packages, they have become one of the biggest trends in the electronics industry, due to their many benefits.
Despite the term "chip-scale package," few packages are actually in size of a chip. Therefore, the IPC/JEDEC definition was taken into consideration. This definition does not mention how a chip-scale package needs to be manufactured or constructed. Any package that meets the dimensional requirements of the definition and has surface mount ability is considered a chip-scale package. Structural dimensions are not given much consideration for classification as a chip-scale package.
There are over 50 different categories of chip-scale packages in the electronics industry, and they are continually evolving as well. Some of the most common forms of CSP include:
There are many benefits associated with chip-scale packages. Size reduction of the package compared to the traditional packages is one of their biggest benefits. The size reduction is mainly possible due to ball grid array design of the package, which increases the number of interconnects. Another advantage associated with chip-scale packages is self-alignment characteristics and the lack of bent leads, features which further help in lowering the manufacturing costs. Unlike other packages, chip-scale packages can take advantage of existing surface mount technology (SMT) and is easier to start manufacturing.
Chip-scale packages are used in electronic devices such as cell phones, smart devices, laptops and digital cameras due to the significant size and weight reduction provided.