Through-Silicon Via (TSV)
Definition - What does Through-Silicon Via (TSV) mean?
Techopedia explains Through-Silicon Via (TSV)
Three-dimensional ICs are vertically stacked chips similar to a 3-D package but act as a single unit, which allows them to pack more functionalities in a relatively small footprint. TSV further enhances this by providing a short high-speed connection between the different layers.
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