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The Occam process is a method of manufacturing printed circuit boards using a reverse-order interconnection solution instead of the traditional soldering method. It involves printing or plating the electronic components onto the board and then encapsulating them, instead of soldering them.
The process was developed by Verdant Electronics (Seattle, WA, USA) and was named after the 14th century philosopher William of Ockham (1288–1348).
In the Occam process for printed circuit boards, components are put onto a substrate and then encapsulated in place. The Occam process arose partly to comply with European RoHS (Restriction of Hazardous Substances) regulations, which ban the use of lead from electrical and electronic products. The Occam process allows designers to comply with RoHS and also to get around certain problems with tin-based soldering material. Although the Occam process can make printed circuit board manufacturing safer and cleaner, costs and labor concerns have slowed down the adoption of this technology. There are also some health concerns about aspects of the materials used with this method, including epoxy.